Thermal Module > Air thermal module
Air thermal module
Type & Spec
1.Server module:
  • Intel chip: 1U/2U/4U/EVAC
  • AMD chip: 1U/2U/4U/ EVAC
  • TDP: 135~500W
    • 2.Netcom module:
  • TDP: 150~500W
    • 3.NB module:
  • Fanless design thickness: ≥1.8 mm
  • Fan design thickness: ≥7.0 mm

    • (centrifugal fan thickness=4.5mm)

    Application
  • Gaming NB
  • DT
  • Workstation
  • NB
  • Tablet
  • Server
  • Netcom